Senior Equipment Engineer – Wafer Lamination & Mounting (f/m/d)

Job description

About us We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects About our technology The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution The Role We are seeking a skilled Senior Equipment Engineer – Wafer Lamination & Mounting at Black Semiconductor to lead the installation, maintenance, and optimization of wafer taping and mounting equipment. You will own the health and performance of fully automated lamination modules, maximizing product quality through equipment reliability and process stability. Working in a fast-paced cleanroom environment, you will optimize tape application parameters, eliminate lamination-related failure modes, and help introduce Black Semiconductor's novel technology to high-volume manufacturing. This role bridges mechanical troubleshooting, equipment engineering, and process optimization. To join our team, you should be excited to Own the performance, reliability, and lifecycle management of wafer taping and mounting equipment at Black Semiconductor, including installation, commissioning, qualification, and preventive maintenance strategy. Lead escalation-level troubleshooting across electromechanical, pneumatic, robotic, motion-control, vacuum, and automation systems in a cleanroom manufacturing environment. Drive root-cause analysis and permanent corrective…